Electronic device

ABSTRACT

An electronic device includes a display panel including a folding area and a non-folding area which is adjacent to the folding area along a first direction, and a support member facing the display panel. The support member includes in order from the display panel, an upper plate which faces the folding area and the non-folding area, has a thickness and in which are defined a plurality of openings corresponding to the folding area, and a lower plate having a thickness which is greater than the thickness of the upper plate and including a first lower plate and a second lower plate each corresponding to the folding area and the non-folding area. At the folding area, the second lower plate is spaced apart from the first lower plate by a gap along the first direction.

This application claims priority to Korean Patent Application No.10-2020-0130931 filed on Oct. 12, 2020, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the disclosure of which is herebyincorporated by reference in its entirety.

BACKGROUND (1) Field

The invention relates to an electronic device, and more particularly, toan electronic device which reduces or effectively prevents introductionof foreign substances while securing foldability, lightness, andimpact-resistant properties.

(2) Description of the Related Art

An electronic device includes an active region that is activated with anelectrical signal. The electronic device may use the active region todetect externally applied inputs and to also display various images toprovide users with information. With the development of variously shapedelectronic devices, the active region has various shapes.

Flexible electronic devices have been developed to include flexibledisplay panels which are foldable. Unlike rigid electronic devices, theflexible electronic devices can be foldable, rollable or bendable. Theflexible electronic device which is deformable into various shapes canbe achieved regardless of an existing screen size to thereby improve auser's convenience.

SUMMARY

One or more embodiment provides an electronic device which reduces oreffectively prevents introduction of foreign substances while securingfolding, lightness, and impact-proof properties.

According one or more embodiment, an electronic device includes adisplay surface including a first non-folding area, a folding area and asecond non-folding area that are sequentially defined along onedirection, a window, a display panel below the window, and a supportmember below the display panel. The support member may include an upperplate in which are defined a plurality of openings that overlap thefolding area, and a lower plate below the upper plate and having athickness greater than a thickness of the upper plate. The lower platemay include a first lower plate and a second lower plate which is spacedapart from the first lower plate. A gap at which the first and secondlower plates are spaced apart from each other may be defined to overlapthe folding area.

In an embodiment, the thickness of the upper plate may be in a range ofabout 15 micrometers to about 50 micrometers. The thickness of the lowerplate may be in a range of about 150 micrometers to about 300micrometers.

In an embodiment, a specific strength of the upper plate may be equal toor greater than about 60 kN·m/kg.

In an embodiment, the upper plate may include at least one selected froma stainless steel, a titanium alloy, a nickel alloy, a beryllium alloyand a nickel-titanium alloy.

In an embodiment, the lower plate may include at least one selected froman aluminum alloy, a nickel alloy, a magnesium alloy, analuminum-magnesium alloy and a glass fiber reinforced plastic (“GFRP”).

In an embodiment, at least one plate folding area may be defined on theupper plate. The plurality of openings may be defined in the platefolding area.

In an embodiment, a width of each of the plurality of openings may beequal to or less than about 50 micrometers.

In an embodiment, the upper plate may include a first plate non-foldingarea, the plate folding area and a second non-folding area that aresequentially arranged along a first direction.

In an embodiment, the electronic device may further include a lowercushion layer below the lower plate.

In an embodiment, the electronic device may further include a cushionlayer between the support member and the display panel.

In an embodiment, the support member may further include a planarizationlayer on the upper plate.

In an embodiment, the planarization layer may include polyurethane orthermoplastic polyurethane.

In an embodiment, the upper plate may include polyimide.

In an embodiment, the electronic device may further include a lowercushion layer below the lower plate.

In an embodiment, the support member may further include a cover filmbetween the upper plate and the lower plate.

In an embodiment, the electronic device may further include anantireflection member between the display panel and the window.

According to an embodiment, an electronic device includes a window, adisplay panel below the window, and a support member below the displaypanel. The support member may include an upper plate in which aplurality of openings are defined, the upper plate including at leastone selected from a stainless steel, a titanium alloy, a nickel alloy, aberyllium alloy and a nickel-titanium alloy, and a lower plate below theupper plate, the lower plate including at least one selected from analuminum alloy, a nickel alloy, a magnesium alloy, an aluminum-magnesiumalloy and a glass fiber reinforced plastic (“GFRP”).

In an embodiment, the upper plate may have a thickness of about 15micrometers to about 50 micrometers.

In an embodiment, the lower plate may have a thickness of about 150micrometers to about 300 micrometers.

According to an embodiment, an electronic device includes a window, adisplay panel below the window, and a support member below the displaypanel. The support member may include an upper plate in which at leastone plate folding area is defined, the upper plate having a thickness ofabout 15 micrometers to about 50 micrometers, and a lower plate belowthe upper plate. A plurality of openings may be defined in the platefolding area.

In an embodiment, the upper plate may include at least one selected froma stainless steel, a titanium alloy, a nickel alloy, a beryllium alloyand a nickel-titanium alloy. The lower plate may include at least oneselected from an aluminum alloy, a nickel alloy, a magnesium alloy, analuminum-magnesium alloy and a glass fiber reinforced plastic (“GFRP”).

In an embodiment, the lower plate may have a thickness of about 150micrometers to about 300 micrometers.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages and features of this disclosure willbecome more apparent by describing in further detail embodiments thereofwith reference to the accompanying drawings, in which:

FIG. 1A illustrates a perspective view showing an embodiment of anelectronic device.

FIG. 1B illustrates a perspective view showing an embodiment of theelectronic device depicted in FIG. 1A which is folded.

FIG. 2A illustrates a perspective view showing an embodiment of anelectronic device.

FIG. 2B illustrates a perspective view showing the electronic devicedepicted in FIG. 2A which is folded.

FIG. 3 illustrates a cross-sectional view showing an embodiment of anelectronic device.

FIG. 4 illustrates a cross-sectional view showing an embodiment of adisplay panel.

FIG. 5A illustrates a perspective view showing an embodiment of acomponent of an electronic device.

FIG. 5B illustrates a plan view of an embodiment of section A depictedin FIG. 5A.

FIG. 5C illustrates a perspective view of an embodiment of section Adepicted in FIG. 5A.

FIGS. 6A to 6C illustrate cross-sectional views showing embodiments ofan electronic device.

DETAILED DESCRIPTION

The following will now describe embodiments of the invention inconjunction with the accompanying drawings. This invention may, however,be embodied in many different forms, and should not be construed aslimited to the embodiments set forth herein. Rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the invention to those skilled in theart. Like numerals indicate like components.

In this description, when a component (or region, layer, portion, etc.)is referred to as being related to another component such as being “on,”“connected to” or “coupled to” other component(s), the component may bedirectly disposed on, directly connected to or directly coupled to theother component(s) or at least one intervening component may be presenttherebetween.

Moreover, in the drawings, thicknesses, ratios, and dimensions ofcomponents are exaggerated for effectively explaining the technicalcontents.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein,“a,” “an,” “the,” and “at least one” do not denote a limitation ofquantity, and are intended to include both the singular and plural,unless the context clearly indicates otherwise. For example, “anelement” has the same meaning as “at least one element,” unless thecontext clearly indicates otherwise. “At least one” is not to beconstrued as limiting “a” or “an.” “Or” means “and/or.” The term“and/or” includes one or more combinations defined by associatedcomponents.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various components, these components shouldnot be limited by these terms. These terms are only used to distinguishone component from another component. For example, a first componentcould be termed a second component, and vice versa without departingfrom the scope of the invention. Unless the context clearly indicatesotherwise, the singular forms are intended to include the plural formsas well.

In addition, the terms “beneath,” “lower,” “above,” “upper” and the likeare used herein to describe one component's relationship to othercomponent(s) illustrated in the drawings. The relative terms areintended to encompass different orientations in addition to theorientation depicted in the drawings.

It should be understood that the terms “comprise,” “include,” “have” andthe like are used to specify the presence of stated features, integers,steps, operations, components, elements, or combinations thereof, but donot preclude the presence or addition of one or more other features,integers, steps, operations, components, elements, or combinationsthereof.

In this description, the phrase “directly disposed” may mean that noadditional element, such a layer, a film, a region or a plate, ispresent between a portion and other portion of a layer, a film, aregion, a plate, or the like. For example, the phrase “directlydisposed” may mean that no additional member such as an adhesive memberis provided between two layers or members.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms used herein including technical andscientific terms have the same meaning generally understood by one ofordinary skilled in the art. Also, terms as defined in dictionariesgenerally used should be understood as having meaning identical ormeaning contextually defined in the art and should not be understood asideally or excessively formal meaning unless definitely defined herein.

Embodiments are described herein with reference to cross sectionillustrations that are schematic illustrations of idealized embodiments.As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments described herein should not be construed aslimited to the particular shapes of regions as illustrated herein butare to include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

The following will now describe embodiments of the invention inconjunction with the accompanying drawings.

FIG. 1A illustrates a perspective view showing an embodiment of anelectronic device 1000. FIG. 1B illustrates a perspective view showingthe electronic device 1000 depicted in FIG. 1A which is folded.

Referring to FIGS. 1A and 1B, an electronic device 1000 may be afoldable display device. The electronic device 1000 may be applicablenot only to large-sized electronic products such as television sets andmonitors, but to small and medium-sized electronic products such asmobile phones, tablet personal computer (“PCs”), automotive navigationsystems, game consoles and smart watches.

The electronic device 1000 may have a top surface defined as a displaysurface DS, and when the electronic device 1000 is folded or unfolded(e.g., flat), the display surface DS may be in a plane parallel to aplane defined by a first direction DR1 and a second direction DR2crossing each other.

The display surface DS may include a display area DA and a non-displayarea NDA adjacent to the display area DA. In an embodiment, thenon-display area NDA may be around the display area DA. The display areaDA may be a planar area where an image IM is displayed, and thenon-display area NDA may be a planar area where the image IM is notdisplayed. FIG. 1A shows application icons as an example of the imageIM.

The display area DA may have a tetragonal shape in a plan view. In anembodiment, the non-display area NDA may surround the display area DA.The invention, however, is not limited thereto, and the display area DAand the non-display area NDA may be relatively designed in shape.

The electronic device 1000 may include a first non-folding area NFA1, afolding area FA and a second non-folding area NFA2 that are sequentiallydefined along the second direction DR2 between the non-folding areasNFA1 and NFA2. The folding area FA may be a planar area at which theelectronic device 1000 and components thereof are foldable. Anon-folding area may be a planar area at which the electronic device1000 and components thereof are not foldable and/or remain flat even inthe electronic device 1000 which is folded.

Various components or layers of the electronic device 1000 may include afolding area FA and a non-folding area corresponding to those describedabove for the electronic device 1000. Various components or layers ofthe electronic device 1000 may be foldable together with each other.

In an embodiment, for example, the folding area FA may be definedbetween the first non-folding area NFA1 and the second non-folding areaNFA2. Although FIGS. 1A and 1B show one of the folding area FA and twoof the non-folding areas NFA1 and NFA2, no limitation is imposed on thenumber of the folding area FA or the number of the non-folding areasNFA1 and NFA2. In an embodiment, for example, the electronic device 1000may include more than two non-folding areas and a plurality of foldingareas each of which is disposed respectively between neighboringnon-folding areas.

The electronic device 1000 may be foldable about a folding axis FX. Inan embodiment, for example, the folding area FA may be bendable aboutthe folding axis FX. The folding axis FX may extend along the firstdirection DR1. The folding axis FX may be defined as a minor axis of theelectronic device 1000 that is parallel to a short side of theelectronic device 1000.

When the electronic device 1000 is folded, portions of the displaysurface DS at the first and second non-folding areas NFA1 and NFA2 mayface each other. Therefore, in the electronic device 1000 which isfolded, the display surface DS may not be exposed externally or faceoutside of the electronic device 1000. This, however, is only anexample, and the invention is not limited thereto. In embodiments, whenthe electronic device 1000 is folded, portions of the display surface DSat the first and second non-folding areas NFA1 and NFA2 may face inopposite directions. Therefore, in display surface DS may be exposedexternally to face outside of the electronic device 1000.

FIG. 2A illustrates a perspective view showing an embodiment of anelectronic device 1000-a. FIG. 2B illustrates a perspective view showingthe electronic device 1000-a depicted in FIG. 2A which is folded.

Referring to FIGS. 2A and 2B, an electronic device 1000-a may include afirst non-folding area NFA1-1, a folding area FA-1 and a secondnon-folding area NFA2-1 that are sequentially defined along the firstdirection DR1. The folding area FA-1 may be defined between the firstnon-folding area NFA1-1 and the second non-folding area NFA2-1.

The electronic device 1000-a may be foldable about a folding axis FX-1.In an embodiment, for example, the folding area FA-1 may be bendableabout the folding axis FX-1. The folding axis FX-1 may extend along thesecond direction DR2. The folding axis FX-1 may be defined as a majoraxis of the electronic device 1000-a that is parallel to a long side ofthe electronic device 1000-a.

The following will discuss a structure of the electronic device 1000that is foldable about the minor axis, but the invention is not limitedthereto, and subsequently described structures may also be applicable tothe electronic device 1000-a that is foldable about the major axis.

FIG. 3 illustrates a cross-sectional view showing an embodiment of anelectronic device 1000. FIG. 3 depicts a cross-sectional view showing anelectronic device 1000 taken along line I-I′ of FIG. 1A. FIG. 4illustrates a cross-sectional view showing an embodiment of a displaypanel 100. FIG. 5A illustrates a perspective view showing an embodimentof a component of an electronic device 1000. FIG. 5B illustrates a planview of an embodiment of section A depicted in FIG. 5A, partiallyshowing a component of an electronic device 1000. FIG. 5C illustrates aperspective view of an embodiment of section A depicted in FIG. 5A,partially showing a component of an electronic device 1000.

FIGS. 3 and 4 describe by way of example the electronic device 1000shown in FIG. 1A, but the invention is not limited thereto, and thedescription of the electronic device 1000 may be similarly applicable tothe electronic device 1000-a shown in FIGS. 2A and 2B. FIG. 5A depicts aperspective view showing an embodiment of an upper plate 600 of anelectronic device 1000. FIG. 5B depicts a plan view showing anembodiment of section A that overlaps the upper plate 600 of FIG. 5A.FIG. 5C depicts a perspective view showing an embodiment of section Athat overlaps the upper plate 600 of FIG. 5A.

Referring to FIG. 3 , the electronic device 1000 may include a displaypanel 100, upper functional layers and lower functional layers. One ormore among the display panel 100, the upper functional layers and thelower functional layers may be foldable and unfoldable together witheach other, without being limited thereto.

Referring to FIG. 4 , the display panel 100 may be a component thatgenerates an image IM and detects an externally applied input. In anembodiment, for example, the display panel 100 may include a displaylayer 110 and a sensor layer 120 which faces the display layer 110. Thedisplay panel 100 may have a thickness of about 25 micrometers to about45 micrometers, for example, of about 35 micrometers, but no limitationis imposed on the thickness of the display panel 100.

The display layer 110 may be a component that substantially generates animage IM. The display layer 110 may be an emissive display layer, forexample, an organic light emitting display layer, a quantum-dot displaylayer or a micro-led display layer. Based on a configuration of thedisplay layer 110, the display panel 100 may be an organic lightemitting display panel, a quantum-dot display panel or a micro-leddisplay panel.

The display layer 110 may include a base layer 111, a circuit layer 112,a light emitting element layer 113 and an encapsulation layer 114 inorder toward the sensor layer 120.

The base layer 111 may include a synthetic resin layer. The syntheticresin layer may include a thermosetting resin. In an embodiment, forexample, the synthetic resin layer may be a polyimide-based resin layer,but no limitation is imposed on the material of the synthetic resinlayer. The synthetic resin layer may include at least one selected fromacryl-based resin, methacryl-based resin, polyisoprene, vinyl-basedresin, epoxy-based resin, urethane-based resin, cellulose-based resin,siloxane-based resin, polyamide-based resin and perylene-based resin.The base layer 111 may include a glass substrate or an organic/inorganiccomposite substrate.

The base layer 111 may have a multi-layered structure. In an embodiment,for example, the base layer 111 may include a first synthetic resinlayer, a silicon oxide (SiOx) layer disposed on the first syntheticresin layer, an amorphous silicon (a-Si) layer disposed on the siliconoxide layer, and a second synthetic resin layer disposed on theamorphous silicon layer. The silicon oxide layer and the amorphoussilicon layer may be called a base barrier layer.

Each of the first and second synthetic resin layers may include apolyimide-based resin. Additionally or alternatively, each of the firstand second synthetic resin layers may include at least one selected fromacrylate-based resin, methacrylate-based resin, polyisoprene-basedresin, vinyl-based resin, epoxy-based resin, urethane-based resin,cellulose-based resin, siloxane-based resin, polyamide-based resin andperylene-based resin. In this description, the language “X-based resin”may mean a resin including a functional group of X.

The base layer 111 may have a thickness of about 10 micrometers to about30 micrometers. In an embodiment, for example, the base layer 111 mayhave a thickness of about 20 micrometers.

The circuit layer 112 may be disposed on the base layer 111. The circuitlayer 112 may include a dielectric layer, a semiconductor pattern, aconductive pattern, a signal line and the like. Coating and depositionprocesses may be employed such that a dielectric layer, a semiconductorlayer and a conductive layer are provided or formed on the base layer111, and then a photolithography process may be performed several timesto selectively pattern the dielectric layer, the semiconductor layer andthe conductive layer. Afterwards, the semiconductor pattern, theconductive pattern and the signal line may be provided or formed whichare included in the circuit layer 112.

The light emitting element layer 113 may be disposed on the circuitlayer 112. The light emitting element layer 113 may include the lightemitting element. In an embodiment, for example, the light emittingelement layer 113 may include an organic light emitting material, aquantum dot, a quantum rod or a micro-led.

A sum of thicknesses of the circuit layer 112 and the light emittingelement layer 113 may range from about 1 micrometer to about 5micrometers. In an embodiment, for example, the circuit layer 112 andthe light emitting element layer 113 may have their total thickness ofabout 3 micrometers.

The encapsulation layer 114 may be disposed on the light emittingelement layer 113. The encapsulation layer 114 may include an inorganiclayer, an organic layer and an inorganic layer that are sequentiallystacked, but no limitation is imposed on the constituent layers of theencapsulation layer 114.

The inorganic layers may protect the light emitting element layer 113against moisture and oxygen, and the organic layer may protect the lightemitting element layer 113 against foreign substances such as dustparticles. The inorganic layers may include a silicon nitride layer, asilicon oxynitride layer, a silicon oxide layer, a titanium oxide layeror an aluminum oxide layer. The organic layer may include an acryl-basedorganic layer, but the invention is not limited thereto.

The encapsulation layer 114 may have a thickness of about 3 micrometersto about 10 micrometers. In an embodiment, for example, theencapsulation layer 114 may have a thickness of about 6 micrometers.

The sensor layer 120 may be disposed on the display layer 110. Thesensor layer 120 may detect an external input TC that is externallyapplied. The external input TC may include light, heat, pressure orcontact from a input tool such as a body part, a pen, etc.

A successive process may be employed to provide or form the sensor layer120 on the display layer 110. In this case, the sensor layer 120 may bedirectly disposed on the display layer 110. In an embodiment, forexample, the sensor layer 120 and the display layer 110 may contact eachother without a third component therebetween. In this case, no adhesivemember may be separately disposed between the sensor layer 120 and thedisplay layer 110. As being in contact, components may form an interfacewith each other since a separate member is omitted therebetween. Whenthe sensor layer 120 is directly disposed on the display layer 110, thesensor layer 120 may have a thickness of about 2 micrometers.

Alternatively, the sensor layer 120 may be coupled to the display layer110 through a third component such as an adhesive member. The adhesivemember may include an ordinary adhesive or glue. In an embodiment, forexample, the adhesive member may include a pressure sensitive adhesive(“PSA”) film (or layer), an optically clear adhesive (“OCA”) film (orlayer) or an optically clear resin (“OCR”).

Referring back to FIG. 3 , the upper functional layers may be disposedon the display panel 100. In an embodiment, for example, the upperfunctional layers may include an antireflection member 200 and an uppermember 300.

The antireflection member 200 may be called an antireflection layer. Theantireflection member 200 may reduce a reflectance of external lightthat is externally incident to the electronic device 1000. Theantireflection member 200 may include a stretchable synthetic resinfilm. In an embodiment, for example, the antireflection member 200 maybe a polyvinyl alcohol (“PVA”) film which is dyed with an iodinecompound. This, however, is merely exemplary, and no limitation isimposed on the material of the antireflection member 200. Theantireflection member 200 may have a thickness of about 3 micrometers toabout 35 micrometers, but no limitation is imposed on the thickness ofthe antireflection member 200.

The antireflection member 200 may include color filters. The colorfilters may be arranged in a pattern. For the antireflection member 200,the color filters may be arranged in consideration of colors emittedfrom pixels included or defined by in the display layer 110. Inaddition, the antireflection member 200 may further include alight-blocking member which is adjacent to the color filters.

The antireflection member 200 may include a destructive-interferencestructure. In an embodiment, for example, the destructive-interferencestructure may include a first reflection layer and a second reflectionlayer that are located at different levels or distances relative to thedisplay panel 100. A first reflected light and a second reflected light,which are respectively reflected from the first reflection layer and thesecond reflection layer, may interfere destructively each other, andthus a reflectance of external light may be reduced.

The antireflection member 200 may be combined with the display panel 100through a first adhesion layer 1010. The first adhesion layer 1010 maybe a transparent adhesive, such as a pressure sensitive adhesive (“PSA”)film, an optically clear adhesive (“OCA”) film, or an optically clearresin (“OCR”). The following described adhesion layer may include anordinary adhesive or glue. The first adhesion layer 1010 may have athickness of about 20 micrometers to about 30 micrometers, for example,of about 25 micrometers, but no limitation is imposed on the thicknessof the first adhesion layer 1010.

In embodiments, the first adhesion layer 1010 may be omitted, and theantireflection member 200 may be directly disposed on the display panel100. In this case, no adhesion layer may be separately disposed betweenthe antireflection member 200 and the display panel 100. When theantireflection member 200 is directly disposed on the display panel 100,the antireflection member 200 may have a thickness of about 4.8micrometers.

The upper member 300 may be disposed on the antireflection member 200.The upper member 300 may face the display panel 100 with theantireflection member 200 therebetween. The upper member 300 may includea first hard coating layer 310, a protection layer 320, a first upperadhesion layer 330, a window 340, a second upper adhesion layer 350, ablack matrix 360, a shock absorption layer 370 and a second hard coatinglayer 380. Components included in the upper member 300 are not limitedthose mentioned above. At least one of the components mentioned abovemay be omitted, and other components may be added to.

The first hard coating layer 310 may be disposed at an outermost side ofthe electronic device 1000. The first hard coating layer 310 may definethe display surface DS. The first hard coating layer 310 may be afunctional layer to improve utility characteristics of the electronicdevice 1000, and may be coated on the protection layer 320. In anembodiment, for example, the first hard coating layer 310 may improveanti-fingerprint properties, pollution-free properties and/oranti-scratch properties. The first hard coating layer 310 may have athickness of about 1 micrometer to about 5 micrometers, for example, ofabout 3 micrometers.

The protection layer 320 may be disposed below the first hard coatinglayer 310. The protection layer 320 may protect components disposedbelow the protection layer 320. To improve chemical resistance and/orwear resistance, the protection layer 320 may be additionally providedthereon with the first hard coating layer 310, an anti-fingerprint layerand the like. The protection layer 320 may include a film whose elasticmodulus is equal to or less than about 15 gigapascals (GPa) at roomtemperature. The protection layer 320 may have a thickness of about 30micrometers to about 200 micrometers, but no limitation is imposed onthe thickness of the protection layer 320. In embodiments, theprotection layer 320 may be omitted.

The protection layer 320 may have a multi-layered structure. In anembodiment, for example, the protection layer 320 may include aplurality of synthetic resin films that are combined with each otherthrough an adhesive. The protection layer 320 may include a firstprotection layer 321, a second protection layer 322 facing the firstprotection layer 321, and a protective adhesion layer 323 that combinesthe first and second protection layers 321 and 322 with each other. Forthe protection layer 320, each of the first and second protection layers321 and 322 may have a thickness of about 30 micrometers to about 120micrometers. In an embodiment, for example, the first protection layer321 may have a thickness of about 100 micrometers, and the secondprotection layer 322 may have a thickness of about 40 micrometers.

The first upper adhesion layer 330 may be disposed below the protectionlayer 320. The first upper adhesion layer 330 may combine the protectionlayer 320 with the window 340. The first upper adhesion layer 330 mayhave a thickness of about 20 micrometers to about 60 micrometers, forexample, of about 50 micrometers, but no limitation is imposed on thethickness of the first upper adhesion layer 330.

The window 340 may be disposed below the first upper adhesion layer 330.The window 340 may include an optically transparent dielectric material.In an embodiment, for example, the window 340 may include a glasssubstrate or a synthetic resin film. When the window 340 is a glasssubstrate, the window 340 may have a thickness of equal to or less thanabout 80 micrometers, for example, of about 40 micrometers, but nolimitation is imposed on the thickness of the window 340.

When the window 340 is a synthetic resin film, the window 340 mayinclude a polyimide (“PI”) film or a polyethylene terephthalate (“PET”)film.

The window 340 may have a single-layered or multi-layered structure. Inan embodiment, for example, the window 340 may include either aplurality of synthetic resin films that are coupled to each otherthrough an adhesive or a glass substrate with a plastic film coupledthereto through an adhesive.

The second hard coating layer 380 may be disposed on a top surface ofthe window 340 which is furthest from the display panel 100. The secondhard coating layer 380 may be a functional layer to improve utilitycharacteristics of the electronic device 1000, and may be coated on thetop surface of the window 340. In an embodiment, for example, the secondhard coating layer 380 may improve pollution-free properties,anti-scratch properties and/or impact-proof properties. The second hardcoating layer 380 may have a thickness of about 1 micrometer to about 5micrometers, for example, of about 1.5 micrometers.

The second upper adhesion layer 350 may be disposed below the window340. The second upper adhesion layer 350 may combine the window 340 withthe shock absorption layer 370. The second upper adhesion layer 350 mayhave a thickness of about 30 micrometers to about 40 micrometers, forexample, of about 35 micrometers, but no limitation is imposed on thethickness of the second upper adhesion layer 350.

In embodiments, a sidewall 340S of the window 340 and a sidewall 350S ofthe second upper adhesion layer 350 may be located more inwardly thansidewalls of other layers, for example, than a sidewall 100S of thedisplay panel 100 and a sidewall 320S of the protection layer 320. Thephrase “located more inwardly than” may mean “is closer than othercomparative components to the display area DA.”

A folding operation of the electronic device 1000 may change apositional relationship between layers. According to embodiments, sincethe sidewall 340S of the window 340 is disposed more inwardly than eachof the sidewall 100S of the display panel 100 and the sidewall 320S ofthe protection layer 320, even when the positional relationship ischanged between layers, protrusion of the sidewall 340S of the window340 further than the sidewall 320S of the protection layer 320 in adirection along the display panel 100 may be less likely. Therefore,transfer of external impact through the sidewall 340S of the window 340is reduced. As a result, cracking of the window 340 from an externalimpact may be reduced.

A first distance 340W may be provided between the sidewall 340S of thewindow 340 and the sidewall 320S of the protection layer 320. In thisdescription, the first distance 340W may indicate a distance in adirection parallel to the first direction DR1 and/or the seconddirection DR2. In addition, when viewed in plan (e.g., in a plan viewalong a third direction DR3 (e.g., thickness direction), the firstdistance 340W may correspond to a distance between the sidewall 340S andthe sidewall 320S.

The first distance 340W may range from about 180 micrometers to about205 micrometers, for example, may be about 196 micrometers, but is notlimited thereto. In an embodiment, for example, the first distance 340Wmay be equal to or greater than about 50 micrometers, for example, maybe about 300 micrometers. An increase in the first distance 340W maycause the protection layer 320 to protrude further than the sidewall340S of the window 340 and to have a bending portion which is attachableto another component, for example, a casing. Moreover, an increase in aplanar area of the protection layer 320 may reduce the introduction offoreign substances from above the protection layer 320 to below theprotection layer 320 and various layers thereunder.

In addition, a lamination process may cause attachment of the window 340and the second upper adhesion layer 350 to the shock absorption layer370. In consideration of an allowance of the lamination process, each ofthe window 340 and the second upper adhesion layer 350 may have a planararea less than that of the shock absorption layer 370. Moreover, theplanar area of the second upper adhesion layer 350 may be less than theplanar area of the window 340 (e.g., relative planar areas areillustrated by dimensions along the second direction DR2 in FIG. 3 , forexample). In an embodiment, for example, the second upper adhesion layer350 may be supplied with pressure in a process where the window 340 isattached. The second upper adhesion layer 350 may be pressurized toexpand in direction parallel to the first and second directions DR1 andDR2, that is, in a direction along the display panel 100. In this case,the planar area of the second upper adhesion layer 350 may be less thanthe planar area of the window 340 so as not to allow the second upperadhesion layer 350 to protrude further than an edge of the window 340defined by the sidewall 340S thereof.

In a case the first upper adhesion layer 330 is attached to the secondupper adhesion layer 350, the window 340 may not be slidable when theelectronic device 1000 is folded and may thus experience a bucklingphenomenon. However, according to embodiments, the planar area of thesecond upper adhesion layer 350 may be less than the planar area of thewindow 340. Therefore, the first upper adhesion layer 330 may remainunattached to the second upper adhesion layer 350, and foreignsubstances may be less likely to be attached to the second upperadhesion layer 350.

A second distance 350W may be provided between the sidewall 350S of thesecond upper adhesion layer 350 and the sidewall 320S of the protectionlayer 320. In this description, the second distance 350W may indicate adistance in a direction parallel to the second direction DR2 and/or thefirst direction DR1. In addition, when viewed in plan, the seconddistance 350W may correspond to a distance between the sidewall 350S andthe sidewall 320S.

The second distance 350W may be about 392 micrometers, but is notlimited thereto. In an embodiment, for example, the second distance 350Wmay range from about 292 micrometers to about 492 micrometers, but isnot limited to this range.

The black matrix 360 may be disposed between the shock absorption layer370 and the second upper adhesion layer 350. The black matrix 360 may beprinted on a top surface of the shock absorption layer 370. The blackmatrix 360 may overlap or correspond to the non-display area NDA. Theblack matrix 360 may be a coated cosmetic layer. The black matrix 360may include a colored organic material or an opaque metallic material,but no limitation is imposed on the material of the black matrix 360.

FIG. 3 depicts by way of example an embodiment in which the black matrix360 is disposed on the top surface of the shock absorption layer 370,but no limitation is imposed on the position of the black matrix 360. Inan embodiment, for example, the black matrix 360 may be provided on atop surface of the protection layer 320, a bottom surface of theprotection layer 320, a top surface of the window 340 or a bottomsurface of the window 340. In addition, the black matrix 360 may includea plurality of layers. In this case, a portion of the black matrix 360may be provided on the top surface of the shock absorption layer 370,and another portion of the black matrix 360 may be provided on the topsurface of the protection layer 320, the bottom surface of theprotection layer 320, the top surface of the window 340 or the bottomsurface of the window 340.

The shock absorption layer 370 may be a functional layer to protect thedisplay panel 100 against external impacts. The shock absorption layer370 may include a film having an elastic modulus is equal to or greaterthan about 1 gigapascal (GPa) at room temperature. The shock absorptionlayer 370 may be a stretchable film having an optical function. In anembodiment, for example, the shock absorption layer 370 may be anoptical axis control film. The shock absorption layer 370 may have athickness of about 35 micrometers to about 45 micrometers, for example,of about 41 micrometers, but no limitation is imposed on the thicknessof the shock absorption layer 370. In embodiments, the shock absorptionlayer 370 may be omitted.

When the shock absorption layer 370 is omitted, the antireflectionmember 200 may be attached through an adhesive (e.g., a second adhesionlayer 1020) to the window 340. When the shock absorption layer 370 isomitted, the antireflection member 200 may contact a bottom surface ofthe second adhesion layer 1020, and the window 340 may contact a topsurface of the second adhesion layer 1020. When the shock absorptionlayer 370 is omitted, the black matrix 360 may be provided on the topsurface of the protection layer 320, the bottom surface of theprotection layer 320, the top surface of the window 340 or the bottomsurface of the window 340.

Although not shown, a planarization member may be provided on a surfaceof the shock absorption layer 370. In embodiments, the shock absorptionlayer 370 may have an uneven surface, and the planarization member maybe provided on one or both of top and bottom surfaces of the shockabsorption layer 370 to planarize the uneven surface. Therefore, hazemay be reduced or effectively prevented at the uneven surface of theshock absorption layer 370.

The upper member 300 may be combined with the antireflection member 200through the second adhesion layer 1020. The second adhesion layer 1020may include an ordinary adhesive or glue. The second adhesion layer 1020may have a thickness of about 20 micrometers to about 60 micrometers,for example, of about 50 micrometers, but no limitation is imposed onthe thickness of the second adhesion layer 1020.

The lower functional layers may be disposed below the display panel 100.In an embodiment, for example, the lower functional layers may include alower protection film 400, a cushion member 500 and a lower supportmember (e.g., a support member). That is, a window 340, a display panel100 and a support member may be in order along a thickness direction.Components included in the lower functional layers are not limited tothose mentioned above. At least one of the components mentioned abovemay be omitted, and other components may be added to.

The lower protection film 400 may be combined through a third adhesionlayer 1030 with a rear surface of the display panel 100. The lowerprotection film 400 may reduce or effectively prevent the rear surfaceof the display panel 100 from being scratched during fabrication of thedisplay panel 100. The lower protection film 400 may be a coloredpolyimide film. In an embodiment, for example, the lower protection film400 may be an opaque yellow film, but is not limited thereto.

The lower protection film 400 may have a thickness of about 20micrometers to about 50 micrometers, for example, of about 32micrometers. The third adhesion layer 1030 may have a thickness of about13 micrometers to about 40 micrometers, for example, of about 25micrometers. However, no limitation is imposed on the thickness of thelower protection film 400 or the thickness of the third adhesion layer1030.

The cushion member 500 may be disposed below the display panel 100. Thecushion member 500 may be located below the lower protection film 400.The cushion member 500 may protect the display panel 100 against impacttransferred upwardly. The cushion member 500 may cause the electronicdevice 1000 to have improved impact-proof properties.

The cushion member 500 may include a barrier film 520 and a cushionlayer 530. That is, the support member further includes in order fromthe display panel 100, a cushion layer 530, the upper plate 600 and thelower plate 700. The cushion member 500 may further include a firstcushion adhesion layer 510 and a second cushion adhesion layer 540.Components included in the cushion member 500 are not limited to thosementioned above, and other components may be added to.

The first and second cushion adhesion layers 510 and 540 may include anordinary adhesive or glue. The cushion member 500 may be attached to thelower protection film 400 at the first cushion adhesion layer 510, andmay be attached to an upper plate 600 at the second cushion adhesionlayer 540. The first cushion adhesion layer 510 may have a thickness ofabout 25 micrometers, and the second cushion adhesion layer 540 may havea thickness of about 8 micrometers. However, no limitation is imposed onthe thickness of the first cushion adhesion layer 510 or the thicknessof the second cushion adhesion layer 540.

The barrier film 520 may be a synthetic resin film, such as a polyimide(“PI”) film, but is not limited thereto. The barrier film 520 mayinclude, for example, at least one selected from polyimide, polyamide(“PA”), polyetheretherketone and polyethylene terephthalate (“PET”).

The barrier film 520 may have a thickness of about 8 micrometers toabout 40 micrometers. In an embodiment, for example, the barrier film520 may have a thickness of about 20 micrometers.

The barrier film 520 may have a high modulus. The barrier film 520 maybe provided to improve impact-proof properties of the electronic device1000. The barrier film 520 may reduce or effectively prevent deformationof the display panel 100 to improve impact-proof properties of thedisplay panel 100.

The cushion layer 530 may include a foam or a sponge. The cushion layer530 may exhibit elasticity and have a porous structure.

The cushion layer 530 may include polyurethane or thermoplasticpolyurethane, however, is not limited thereto, and the cushion layer 530may include any material as long as the material is able to absorbimpact.

The cushion layer 530 may be provided or formed by using the barrierfilm 520 as a base member. In an embodiment, for example, the cushionlayer 530 may be provided or formed by coating a mixture that includes apolyurethane resin and a foaming agent on the barrier film 520, and thenfoaming the foaming agent. The cushion layer 530 may be directlydisposed on a bottom surface of the barrier film 520. The cushion layer530 may be in contact with the bottom surface of the barrier film 520.Alternatively, the cushion layer 530 may be attached through an adhesionmember to the bottom surface of the barrier film 520.

The cushion layer 530 may have a thickness of about 80 micrometers toabout 120 micrometers. In an embodiment, for example, the cushion layer530 may have a thickness of about 100 micrometers.

One or both of the barrier film 520 and the cushion layer 530 may have acolor to absorb light. In an embodiment, for example, one or both of thebarrier film 520 and the cushion layer 530 may have a black color. Oneor both of the barrier film 520 and the cushion layer 530 may include ablack-colored material. Therefore, external recognition of componentsdisposed below the cushion member 500 may be reduced or effectivelyprevented. In an embodiment, for example, as one or both of the barrierfilm 520 and the cushion layer 530 include a black-colored material,external recognition of the upper plate 600 including metal may bereduced or effectively prevented.

The lower support member may be disposed below the cushion member 500.The second cushion adhesion layer 540 may attach the cushion member 500to a top surface of the upper plate 600 included in the lower supportmember. The lower support member may support components disposed thereonin the third direction DR3.

The lower support member may include the upper plate 600 and a lowerplate 700. Components included in the lower support member are notlimited to those mentioned above. Other components may be added to. Thelower support member may further include a support adhesion layer 1040that is disposed between and mutually connects the upper plate 600 andthe lower plate 700 to each other. The support adhesion layer 1040 mayinclude a plurality of support adhesion patterns spaced apart from eachother at the folding area FA. That is, the support adhesion layer 1040is disconnected at the folding area FA.

The upper plate 600 may support components disposed thereon. Inaddition, the upper plate 600 may improve thermal radiation performanceof the electronic device 1000 (e.g., heat dissipating layer).

The upper plate 600 may define an opening 601 provided in pluralincluding a plurality of openings 601. The opening 601 may be defined ata location of the upper plate 600 which corresponds to the folding areaFA. In an embodiment, for example, when viewed in plan along the firstdirection DR1, the opening 601 may overlap or be aligned with thefolding area FA. The opening 601 may facilitate partial deformation ofthe upper plate 600 at the folding area FA.

For the electronic device 1000, the upper plate 600 may have a firstthickness d1 less than a second thickness d2 of the lower plate 700. Thefirst thickness d1 of the upper plate 600 may be equal to or less thanabout 50 micrometers. The first thickness d1 of the upper plate 600 mayrange from about 15 micrometers to about 50 micrometers. The thicknessmay be a maximum thickness or total thickness of a component, withoutbeing limited thereto.

The upper plate 600 may include a material with high stiffness. Theupper plate 600 may include a metallic material whose specific strength,or strength-to-weight ratio, is equal to or greater than about 60kilonewton meters per kilogram (kN·m/kg). In this description, thespecific strength is a material's strength (force per unit area atfailure) divided by its density, and it may be known that a materialwith a high specific strength has a high ratio of strength to weight. Ametallic material included in the upper plate 600 may have a specificstrength of equal to or greater than about 60 kN·m/kg, such as equal toor greater than about 100 kN·m/kg, or equal to or greater than about 150kN·m/kg. That is, within the support member, the upper plate 600 whichis closer to the display panel 100 than the lower plate 700 has aspecific strength which is equal to or greater than about 60 kN·m/kg.

The upper plate 600 may include at least one selected from stainlesssteel, a titanium alloy, a nickel alloy, a beryllium alloy and anickel-titanium alloy (commercially known as Nitinol). In an embodiment,for example, the upper plate 600 may include at least one of SUS304,SUS316, titanium copper, nickel copper, beryllium copper and Nitinol.That is, within the support member, the upper plate 600 which is closerto the display panel 100 than the lower plate 700 includes stainlesssteel, a titanium alloy, a nickel alloy, a beryllium alloy or anickel-titanium alloy.

Referring to FIGS. 3 and 5A to 5C, the upper plate 600 included in theelectronic device 1000 may include a first plate non-folding area 600A1,a plate folding area 600A2 and a second plate non-folding area 600A3that are arranged along the second direction DR2. The plate folding area600A2 of the upper plate 600 may overlap or correspond to the foldingarea FA of the electronic device 1000. That is, within the supportmember, the upper plate 600 includes a plate folding area 600A2corresponding to the folding area FA of the display panel 100 and atwhich the upper plate 600 is foldable together with the display panel100.

The upper plate 600 may include the first and second plate non-foldingareas 600A1 and 600A3 respectively connected to the plate folding area600A2, that at least a portion of the first plate non-folding area 600A1overlaps or corresponds to the first non-folding area NFA1 of theelectronic device 1000, and that at least a portion of the second platenon-folding area 600A3 overlaps or corresponds to the second non-foldingarea NFA2 of the electronic device 1000. That is, the upper plate 600further includes a plate non-folding area which corresponds to thenon-folding area of the display panel 100 and is adjacent to the platefolding area 600A2.

At least a portion of one or more of the first and second platenon-folding areas 600A1 and 600A3 may overlap the non-display area NDAof the electronic device 1000. The upper plate 600 may include a firstpart 600-1 that overlaps or corresponds to the first plate non-foldingarea 600A1, a second part 600-2 that overlaps or corresponds to theplate folding area 600A2, and a third part 600-3 that overlaps orcorresponds to the second plate non-folding area 600A3. Each of thefirst part 600-1, the second part 600-2 and the third part 600-3 mayinclude a solid portion of the upper plate 600.

The upper plate 600 may define a plurality of openings 601 in the secondpart 600-2 which corresponds to the plate folding area 600A2. At thesecond part 600-2, solid portions of the upper plate 600 may be spacedapart from each other to define the openings 601. The openings 601 mayoverlap the folding area FA of the electronic device 1000. The openings601 may be provided in plural rows. The openings 601 may be provided inplural rows and the openings 601 in the plural rows may be staggeredwith each along plural columns.

In embodiments, the plurality of openings 601 may include a firstopening 6011 provided in plural including a plurality of first openings6011 arranged in a first row and a second opening 6012 provided inplural including a plurality of second openings 6012 arranged in asecond row. The opening rows may extend along the first direction DR1,that is, parallel to the folding axis FX. The first row and the secondrow may alternate with each other within the second part 600-2.

The plurality of first openings 6011 in the first row may lengthwiseextend along the first direction DR1 and may be spaced apart from eachother along the first direction DR1. The plurality of second openings6012 may lengthwise extend along the first direction DR1 and may bespaced apart from each other along the first direction DR1 and from theplurality of first openings 6011 along the second direction DR2. Theplurality of first openings 6011 and the plurality of second openings6012 may be defined alternately along the second direction DR2.Positions of the plurality of first openings 6011 and positions of theplurality of second openings 6012 may be staggered along the seconddirection DR2.

The upper plate 600 may include a top surface which is closest to thedisplay panel 100 and a bottom surface which is opposite to the topsurface. Each of the openings 601 may have an inner lateral surfacedefined by a side surface of the upper plate 600. The inner lateralsurface includes a first lateral surface 601-S1 and a second lateralsurface 601-S2 extended from the first lateral surface 601-S1. The firstlateral surface 601-S1 may be a surface of the upper plate 600 thatdefines each of the plurality of openings 601. The second lateralsurface 601-S2 may be a surface of the upper plate 600 that is inclinedrelative to the first lateral surface 601-S1 (e.g., has an inclination)and connects the first lateral surface 601-S1 to the top surface of theupper plate 600. The second lateral surface 601-S2 may be a chamferededge surface extended between the first lateral surface 601-S1 and thetop surface of the upper plate 600.

Each of the openings 601 may have a major dimension (e.g., length) and aminor dimension (e.g., width). Each of the plurality of openings 601defined in the upper plate 600 may have a width of equal to or less thanabout 50 micrometers. Referring to FIGS. 5A-5C, for example, each of theplurality of openings 601 defined in the upper plate 600 may have awidth of equal to or less than about 50 micrometers along the seconddirection DR2.

When viewed along a thickness direction (e.g., along a third directionDR3), the plurality of openings 601 may be provided or formed tocompletely penetrate a thickness of the upper plate 600. A penetrationdepth of the openings 601 may be defined by a depth of the openingrelative to a total thickness of the upper plate 600, without beinglimited thereto. In an embodiment, for example, the plurality ofopenings 601 may have a penetration depth substantially the same as thefirst thickness d1 of the upper plate 600. The invention, however, isnot limited thereto, and the plurality of openings 601 may be providedor formed to partially penetrate the first thickness d1 of the upperplate 600. In an embodiment, for example, the plurality of openings 601may be provided or formed by half etching a thickness portion of theupper plate 600, and thus each of the plurality of openings 601 may havea groove shape that is providing by etching away to half of the firstthickness d1 of the upper plate 600. The groove shape may define arecess which is open at the top surface or the bottom surface of theupper plate 600.

The lower plate 700 may be disposed facing the upper plate 600. Thelower plate 700 may include plate portions (e.g., lower plates) providedin plural, and the plurality of plate portions may be disposed spacedapart from each other. That is, the lower plate 700 may be disconnectedat the folding area FA. In an embodiment, for example, one plate portionmay be located corresponding to the first non-folding area NFA1, andanother plate portion may be located corresponding to the secondnon-folding area NFA2.

The plurality of plate portions may include a first lower plate 701disposed corresponding to the first non-folding area NFA1 and a secondlower plate 702 disposed corresponding to the second non-folding areaNFA2. Each of the first and second lower plates 701 and 702 may extendfrom a respective non-folding area and into the folding area FA. In anembodiment, the support member (e.g., lower support member) includes inorder from the display panel 100, the upper plate 600 which faces thefolding area FA and the non-folding area of the display panel 100, has athickness and in which are defined a plurality of openings 601corresponding to the folding area FA and a lower plate 700 having athickness which is greater than the thickness of the upper plate 600,the lower plate 700 including a first lower plate 701 and a second lowerplate 702 each corresponding to the folding area FA and the non-foldingarea of the display panel 100.

The first and second lower plates 701 and 702 may be disposed spacedapart from each other at the folding area by a gap G1. The gap G1 atwhich the first and second lower plates 701 and 702 are spaced apartfrom each other may be defined to overlap the folding area FA. Althoughthe first and second lower plates 701 and 702 are disposed spaced apartfrom each other at the folding area FA, the first and second lowerplates 701 and 702 may be located as near to each other as maximallypossible to support a region of the upper plate 600 which includes theopenings 601. In an embodiment, for example, the first and second lowerplates 701 and 702 may reduce or effectively prevent deformation of theupper plate 600 at the region having the openings 601 due to downwardpressure.

Each of the first and second lower plates 701 and 702 may be attachedthrough the support adhesion layer 1040 to the upper plate 600. In anembodiment, for example, the upper plate 600 may be provided with onesupport adhesion pattern corresponding to the first non-folding areaNFA1, and may also be provided with another support adhesion patterncorresponding to the second non-folding area NFA2. In an embodiment, forexample, no portion or pattern of the support adhesion layer 1040 mayoverlap the folding area FA. That is, the support adhesion layer 1040 isspaced apart from the folding area FA. Each portion or pattern of thesupport adhesion layer 1040 may have a thickness of about 8 micrometersto about 15 micrometers, for example, of about 8 micrometers, but nolimitation is imposed on the thickness of the portion or pattern of thesupport adhesion layer 1040.

For the electronic device 1000, the second thickness d2 of the lowerplate 700 may be greater than the first thickness d1 of the upper plate600. The second thickness d2 of the lower plate 700 may be equal to orgreater than about 150 micrometers. The second thickness d2 of the lowerplate 700 may range from about 150 micrometers to about 300 micrometers.That is, within the support member, the thickness of the upper plate 600is in a range of about 15 micrometers to about 50 micrometers, togetherwith the thickness of the lower plate 700 being in a range of about 150micrometers to about 300 micrometers.

The lower plate 700 may include a metal alloy. Each of the first andsecond lower plates 701 and 702 may include a metal alloy. The lowerplate 700 may include a lightweight material whose thermal conductivityis high enough to secure thermal radiation properties (e.g., heatdissipation member). The lower plate 700 may include a material whosedensity is equal to or less than about 3 milligrams per cubic centimeter(mg/cm³). In an embodiment, for example, the lower plate 700 may includeat least one selected from an aluminum alloy, a nickel alloy, analuminum-magnesium alloy and a magnesium alloy. In this description, thealuminum-magnesium alloy may indicate an alloy in which magnesium isadded to aluminum. Alternatively, the lower plate 700 may include amaterial, other than a metal alloy, having secured lightness and thermalradiation properties. In an embodiment, for example, the lower plate 700may include a glass fiber reinforced plastic (“GFRP”). That is, withinthe support member, the lower plate 700 which is further from thedisplay panel 100 than the upper plate 600 includes an aluminum alloy, anickel alloy, a magnesium alloy, an aluminum-magnesium alloy or a glassfiber reinforced plastic.

Although not shown, a step-difference compensation film may further bedisposed between the upper plate 600 and each of the first and secondlower plates 701 and 702, respectively. In an embodiment, for example,the step-difference compensation film may be provided on a region thatoverlaps the folding area FA. The step-difference compensation film mayhave an adhesive force at one surface thereof less than an adhesiveforce at another surface (e.g., opposing surface) thereof. In anembodiment, for example, the one surface may have no adhesive force. Theone surface having no adhesive force may face the upper plate 600.

Alternatively, the step-difference compensation film may be attachedbelow the upper plate 600. In an embodiment, for example, the lowerplate 700 may be attached through a lower adhesion layer to one lowerportion of the upper plate 600, and the step-difference compensationfilm may be attached to another lower portion of the upper plate 600.The step-difference compensation film may be attached through acompensation adhesion layer to the bottom surface of the upper plate600. The step-difference compensation film may be a synthetic resinfilm. The step-difference compensation film may be provided with anothercompensation film on a bottom surface thereof, and thus may be attachedto a lower set (not shown).

Although not shown, the electronic device 1000 may further include athermal radiation sheet and a dielectric sheet that are disposed belowthe lower plate 700. The thermal radiation sheet may be a thermalconductive sheet having high thermal conductivity. In an embodiment, forexample, the thermal radiation sheet may include a thermal radiationlayer, a thermal radiation adhesion layer and a gap tape.

The thermal radiation layer may be attached through the thermalradiation adhesion layer to the lower plate 700. The thermal radiationlayer may be encapsulated by the thermal radiation adhesion layer andthe gap tape. The thermal radiation layer may be a graphite polymerfilm. In an embodiment, for example, the thermal radiation layer may bea graphite polyimide film. The gap tape may be attached through twothermal radiation layers that are spaced apart from each other acrossthe thermal radiation layer. The thermal radiation adhesion layer mayhave a thickness of about 3 micrometers to about 8 micrometers, forexample, of about 5 micrometers. Each of the thermal radiation layer andthe gap tape may have a thickness of about 10 micrometers to about 25micrometers, for example, of about 17 micrometers.

The dielectric film may be attached below the thermal radiation sheet.In an embodiment, for example, the dielectric film may be attachedthrough the thermal radiation adhesion layer to a lower portion of thethermal radiation sheet. The dielectric film may prevent the electronicdevice 1000 from rattling. The dielectric film may have a thickness ofabout 15 micrometers, but is not limited thereto.

Although not shown, the lower plate 700 may further be providedthereunder with a lower cushion film 500-1 (see FIG. 6A) that includes alower cushion layer. The lower cushion layer may absorb external impactapplied to the electronic device 1000. That is, the support memberfurther includes in order from the display panel 100, the upper plate600, the lower plate 700, and a lower cushion layer.

An electronic device 1000 may include a display panel 100 which isprovided thereunder with a lower support member that includes a thinupper plate having a plurality of plate openings defined at a foldingregion and a thick lower plate disposed below the thin upper plate. Thethin upper plate may include a high-stiffness material such as astainless steel, a titanium alloy, a nickel alloy, a beryllium alloy anda nickel-titanium alloy commercially known as Nitinol, and the thicklower plate may include a lightweight material such as an aluminumalloy, a nickel alloy, a magnesium alloy, an aluminum-magnesium alloyand a glass fiber reinforced plastic (“GFRP”). Therefore, one or moreembodiment of the electronic device 1000 may reduce or effectivelyprevent introduction of foreign substances while securing folding,lightness and impact-proof properties.

In embodiments, for example, the electronic device 1000 may include anupper plate 600 whose thickness is small and whose stiffness is high.Therefore, not only are components such as a display panel 100 disposedon the upper plate 600 supported, but reduced sizes of a plurality ofopenings 601 in the plate folding area 600A2 reduces or effectivelyprevents introduction of foreign substances introduced into the displaypanel 100 through the upper plate 600. In addition, the lower plate 700may be thicker than the upper plate 600 and may include a lightweightmaterial, such that sagging of upper-side components such as the upperplate 600 is reduced or effectively prevented and thermal radiationproperties and impact-proof properties are secured. Accordingly, one ormore embodiment of the electronic device 1000 may reduce or effectivelyprevent introduction of foreign substances and secure folding, lightnessand impact-proof properties.

FIGS. 6A to 6C illustrate cross-sectional views showing embodiments ofelectronic devices 1000-1, 1000-2, and 1000-3. In explaining theelectronic devices 1000-1, 1000-2, and 1000-3 with reference to FIGS. 6Ato 6C, the same components as those discussed above in FIG. 3 will beallocated the same reference numerals and detailed description thereofwill be omitted.

Referring to FIG. 6A, the electronic device 1000-1 may not include thecushion member 500 of the electronic device 1000 shown in FIG. 3 . Asthe cushion member 500 is omitted, a fourth adhesion layer 1050 forattaching a planarization layer 800 to the lower protection film 400 maybe provided.

The electronic device 1000-1 may further include a planarization layer800 disposed on the upper plate 600. That is, the support member furtherincludes in order from the display panel 100, a planarization layer 800,the upper plate 600 and the lower plate 700. The planarization layer 800may be attached to the upper plate 600 through an additional adhesionlayer 1060. Although not shown, the planarization layer 800 may becoated on the top surface of the upper plate 600 without a separateadhesion layer therebetween. In an embodiment, for example, theplanarization layer 800 may be in contact with the top surface of theupper plate 600.

The planarization layer 800 may be disposed on the top surface of theupper plate 600, thereby serving to reduce surface roughness of theupper plate 600. The planarization layer 800 may be disposed on the topsurface of the upper plate 600, thereby serving to improve surfacequality of the upper plate 600. The planarization layer 800 may includea colored material such as a black-colored material, and may thus reduceor effectively prevent external recognition of components disposed belowthe planarization layer 800. In an embodiment, for example, externalrecognition of components such as the upper plate 600 that includesmetal may be reduced or effectively prevented.

When the planarization layer 800 is a component coated on the topsurface of the upper plate 600, the planarization layer 800 may be apolymer resin in which a black pigment, such as carbon black, isdistributed. In an embodiment, for example, the planarization layer 800may include a carbon black distributed in a polymeric material such asacryl resin, melamine resin, epoxy resin or urethane resin. Theplanarization layer 800 may be a single-layer film in which a carbonblack is distributed in a polymer resin. Alternatively, theplanarization layer 800 may be provided in the film shape ofpolyurethane or thermoplastic polyurethane, and may be attached to theupper plate 600 through the additional adhesion layer 1060.

The planarization layer 800 may have a thickness of about 5 micrometersto about 10 micrometers. In an embodiment, for example, theplanarization layer 800 may have a thickness of about 8 micrometers. Theadditional adhesion layer 1060 may have a thickness of about 5micrometers to about 15 micrometers. In an embodiment, for example, theadditional adhesion layer 1060 may have a thickness of about 10micrometers.

Although not shown, the planarization layer 800 may have a plurality ofplanarization layer openings that are defined at the folding area FA.The plurality of planarization layer openings defined in theplanarization layer 800 may be provided or formed to correspond to theopenings 601 defined in the upper plate 600. Therefore, when viewed inplan, the openings 601 defined in the upper plate 600 may remain open tooutside the electronic device 1000-1 a without being covered with theplanarization layer 800. Thus, during a folding operation of theelectronic device 1000-1, the plate folding area 600A2 of the upperplate 600 may be easily deformed with no reduction in foldingproperties.

A lower cushion film 500-1 that includes a lower cushion layer may beprovided under the lower plate 700. The lower cushion film 500-1 mayinclude a first lower cushion film 501-1 disposed below the first lowerplate 701, and may also include a second lower cushion film 502-1disposed below the second lower plate 702. The lower cushion film 500-1may include a lower cushion layer and an adhesion layer which isattached to a bottom surface of the lower plate 700 through the lowercushion layer. The lower cushion layer may absorb external impactapplied to the electronic device 1000-1.

Referring to FIG. 6B, the electronic device 1000-2 may not include thecushion member 500 of the electronic device 1000 shown in FIG. 3 .

The electronic device 1000-2 may not include the cushion member 500, butinstead include an upper plate 600-1 including a polymeric materialrather than a metallic material. The polymeric material included in theupper plate 600-1 may be a material that is readily etched to form anopening 601 and that has high stiffness while securing foldingproperties. The upper plate 600-1 may include, for example, polyimide.The upper plate 600-1 may be a polyimide film with high stiffness. Theupper plate 600-1 may be a high-stiffness polyimide film whose modulusranges from about 1 GPa to about 15 GPa. As the upper plate 600-1includes a polymeric material with high stiffness, the electronic device1000-2 may secure folding properties, may have improved surface qualityenough to reduce or effectively prevent external recognition ofunderlying components, and may be free of the occurrence of buckling.

Referring to FIG. 6C, the electronic device 1000-3 may further include acover film 900 disposed between the upper plate 600 and the lower plate700. In an embodiment, the plurality of openings 601 of the upper plate600 are exposed to outside the lower plate 700 by the gap G1 at whichthe second lower plate 702 is spaced apart from the first lower plate701. Here, the support member further includes in order from the displaypanel 100, the upper plate 600, a cover film 900 and the lower plate 700and the cover film 900 extends across the gap G1.

The cover film 900 may be attached to the bottom surface of the upperplate 600 through a first support adhesion layer 1040-1. The firstsupport adhesion layer 1040-1 may include an ordinary adhesive or glue.As shown in FIG. 6C, the first support adhesion layer 1040-1 may not bedisposed on a region that overlaps the folding area FA on the upperplate 600 (e.g., may be spaced apart from the folding area FA). Thecover film 900 may cover the openings 601 of the upper plate 600.Therefore, introduction of foreign substances into the openings 601 maybe additionally reduced or effectively prevented. The cover film 900 maybe attached to the top surface of the lower plate 700 through a secondsupport adhesion layer 1040-2.

The cover film 900 may include a material whose elastic modulus lessthan that of the upper plate 600. The cover film 900 may include amaterial whose elastic modulus is equal to or less than about 30megapascals (MPa) and whose elongation is equal to or greater than about100%. In an embodiment, for example, the cover film 900 may include atleast one selected from acryl-based resin, methacryl-based resin,polyisoprene, vinyl-based resin, epoxy-based resin, urethane-basedresin, cellulose-based resin, siloxane-based resin, polyimide-basedresin, polyamide-based resin and perylene-based resin. In an embodiment,for example, the cover film 900 may include thermoplastic polyurethanebut is not limited thereto. The cover film 900 may be a thermoplasticpolyurethane film in which a mesh pattern is provided or formed.

According to embodiments, a lower support member that includes a thinupper plate with high stiffness and a thick lower plate including alightweight material may be provided under a display panel 100. Thus, anelectronic device 1000 which reduces or effectively prevents entry offoreign substances into the display panel 100 after passing through thelower support member may be provided, while securing folding, lightnessand impact-proof properties thereof, which may result in an improvementin reliability of the electronic device 1000.

Although embodiments have been described with reference to a number ofillustrative examples thereof, it will be understood by those ofordinary skill in the art that various changes in form and details maybe made without departing from the spirit and scope of the invention asset forth in the following claims. Thus, the technical scope of theinvention is not limited by the embodiments and examples describedabove, but by the following claims.

What is claimed is:
 1. An electronic device comprising: a display panelincluding a folding area at which the electronic device is foldable anda non-folding area which is adjacent to the folding area along a firstdirection; and a support member facing the display panel, wherein thesupport member includes in order from the display panel: an upper platewhich faces the folding area and the non-folding area of the displaypanel, has a thickness and in which are defined a plurality of openingscorresponding to the folding area; and a lower plate having a thicknesswhich is greater than the thickness of the upper plate, the lower plateincluding a first lower plate and a second lower plate eachcorresponding to the folding area and the non-folding area of thedisplay panel, wherein at the folding area, the second lower plate isspaced apart from the first lower plate by a gap along the firstdirection.
 2. The electronic device of claim 1, wherein within thesupport member, the thickness of the upper plate is in a range of about15 micrometers to about 50 micrometers, together with the thickness ofthe lower plate being in a range of about 150 micrometers to about 300micrometers.
 3. The electronic device of claim 1, wherein within thesupport member, the upper plate which is closer to the display panelthan the lower plate has a specific strength which is equal to orgreater than about 60 kN·m/kg.
 4. The electronic device of claim 1,wherein within the support member, the upper plate which is closer tothe display panel than the lower plate includes stainless steel, atitanium alloy, a nickel alloy, a beryllium alloy or a nickel-titaniumalloy.
 5. The electronic device of claim 1, wherein within the supportmember, the lower plate which is further from the display panel than theupper plate includes an aluminum alloy, a nickel alloy, a magnesiumalloy, an aluminum-magnesium alloy or a glass fiber reinforced plastic.6. The electronic device of claim 1, wherein within the support member,the upper plate includes a plate folding area corresponding to thefolding area of the display panel and at which the upper plate isfoldable together with the display panel, wherein the plurality ofopenings of the upper plate are defined in the plate folding area. 7.The electronic device of claim 6, wherein within the plate folding areaof the upper plate, each of the plurality of openings has a width alongthe first direction, and the width of each of the plurality of openingsis equal to or less than about 50 micrometers.
 8. The electronic deviceof claim 6, wherein the upper plate further includes a plate non-foldingarea which corresponds to the non-folding area of the display panel andis adjacent to the plate folding area along the first direction.
 9. Theelectronic device of claim 8, wherein the support member furtherincludes in order from the display panel the upper plate, the lowerplate, and a lower cushion layer corresponding to the plate non-foldingarea of the upper plate.
 10. The electronic device of claim 1, whereinthe support member further includes in order from the display panel acushion layer, the upper plate and the lower plate.
 11. The electronicdevice of claim 1, wherein the support member further includes in orderfrom the display panel, a planarization layer, the upper plate and thelower plate.
 12. The electronic device of claim 11, wherein theplanarization layer includes polyurethane or thermoplastic polyurethane.13. The electronic device of claim 1, wherein within the support member,the upper plate which is closer to the display panel than the lowerplate includes polyimide.
 14. The electronic device of claim 13, whereinthe support member further includes in order from the display panel theupper plate, the lower plate and a lower cushion layer.
 15. Theelectronic device of claim 1, wherein the support member furtherincludes in order from the display panel, the upper plate, a cover filmand the lower plate, and the cover film extends across the gap at whichthe second lower plate is spaced apart from the first lower plate. 16.The electronic device of claim 1, further comprising in order toward thesupport member: a window; an antireflection member facing the window;and the display panel.
 17. An electronic device, comprising: a window, adisplay panel and a support member in order, wherein the support memberincludes in order from the display panel: an upper plate includingstainless steel, a titanium alloy, a nickel alloy, a beryllium alloy ora nickel-titanium alloy, a plate folding area at which the upper plateis foldable and in which a plurality of openings are definedcorresponding to the plate folding area; and a lower plate including analuminum alloy, a nickel alloy, a magnesium alloy, an aluminum-magnesiumalloy or a glass fiber reinforced plastic.
 18. The electronic device ofclaim 17, wherein within the support member, the upper plate which iscloser to the display panel than the lower plate has a thickness ofabout 15 micrometers to about 50 micrometers.
 19. The electronic deviceof claim 17, wherein within the support member, the lower plate which isfurther from the display panel than the upper plate has a thickness ofabout 150 micrometers to about 300 micrometers.
 20. An electronicdevice, comprising: a window, a display panel and a support member inorder, wherein the support member includes in order from the displaypanel: an upper plate which has a thickness of about 15 micrometers toabout 50 micrometers, includes a plate folding area at which the upperplate is foldable and in which a plurality of openings is definedcorresponding to the plate folding area; and a lower plate facing theplate folding area of the upper plate.
 21. The electronic device ofclaim 20, wherein within the support member, the upper plate which iscloser to the display panel and has the thickness of about 15micrometers to about 50 micrometers further includes stainless steel, atitanium alloy, a nickel alloy, a beryllium alloy or a nickel-titaniumalloy, together with the lower plate including an aluminum alloy, anickel alloy, a magnesium alloy, an aluminum-magnesium alloy or a glassfiber reinforced plastic.
 22. The electronic device of claim 20, whereinthe lower plate which is further from the upper plate than the displaypanel has a thickness of about 150 micrometers to about 300 micrometers.